END SURFACES
Electroplated nickel / gold
With the galvanic nickel/gold system, we can offer hard gold and bond gold coatings. Freely programmable sequences enable the construction of different layer combinations. We have flexible frame technology available for processing materials of different thicknesses.
| format | max. 610 x 900 mm min. 100 x 100 mm |
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| plate thickness | 0.050 – 20 mm |
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| MicroVias | 1:1 |
| layer properties: Electroplated nickel / gold |
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| Nickel | hardness 400 – 450 HV |
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| hard gold | alloy cobalt purity 99,8% hardness 140 – 170 HV density 17 g/cm³ |
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| soft gold | purity 99.99% hardness 80 – 110 HV density 19.0 g/cm³ |
electroless nickel / gold
Modern system control and automatic dosing devices are prerequisites for a constant quality of the separation. We have various baskets available for a large number of format sizes and thicknesses.
| format | 630 x 605 mm min.100 x 200 mm |
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| plate thickness | 0.050 – 15 mm |
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| Aspect Ratio | 1:15 (Drilling freely developed) |
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| capacity | 1000 m² / day (ca. 2000 – 3000 Panel) |
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| phosphorus content Ni content Ni |
7 – 10 % |
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| hardness Ni | ca. 500 HV |
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| empf. Au layer thickness | 0.05 – 0.1 μm |
Immersion Silver / Immersion Gold (ISIG)
The specified layer thicknesses can be used as a multifunctional surface can be used for all soldering and wire bonding applications. Gold layer thicknesses of up to a maximum of 0.3 µm can be deposited with the process. The combination of layers is particularly suitable for high-frequency circuits, medical technology (no nickel) as well as for fine-line technology and flexible printed circuit boards (low total layer thickness). The semi-automatic system enables separation with constant quality, using system control and automatic dosing devices.
| format | max. 630 x 605 mm min. 200 x 100 mm |
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| plate thickness | 0.050 – 16.0 mm |
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| Aspect Ratio | 1:15 (Bohrungen frei entwickelt) |
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| capacity | 100 m² / day |
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| Ag layer thickness* | 0.1 – 0.4 µm |
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| Au layer thickness* | 0.05 – 0.20 µm for soldering application 0.10 – 0.20 µm for mixed assembly and bonding applications |
*Layer thickness recommendation from the process supplier
electroless Palladium / semi-reductive Gold (EPIG)
Electroless palladium gold is a nickel-free finish that can be used in a variety of ways. The layer is suitable for any type of soldering and bonding application. Palladium serves as a diffusion barrier and the gold layer thickness can be variably adjusted up to 0.3 µm thanks to the partially reductive character.
application
Reflow soldering and bonding (aluminum and gold wire) fine line, high-frequency and medical technology
layer properties
Planar surface, bondable with aluminum and gold wire as well as alternative bonding wires, storage time ≥ 12 months
layer thicknesses
0.1 – 0.2 µm Pd / 0.1 – 0.2 µm Auv
| format | 610 x 610 mm min. on request (ca. 100 x 100 mm) |
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| plate thickness | 25 µm – 10 mm |
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| Aspect ratio PTH |
1:16 |
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| Aspect ratio BV |
1:1 (after copper plating) |
reductive gold
layer properties: reductive gold
| format | max. 610 x 530 mm |
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| Au grade | 99.99 % |
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| hardness | 60 HV |
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| density | 19 g /cm3 |
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| solderability | well |
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| layer thickness | empf. 0.5 – 0.8 μm for Au wire Bo. |
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| capacity | 30 m2 / day |
Electroless Nickel / Palladium / Gold (ENEPIG)
With the reductively deposited palladium as an intermediate layer, excellent bonding results are achieved with gold wire bonding. This layer is also very suitable for soldering applications and aluminum wire bonding.
| format | 630 x 605 mm min. 100 x 200 mm |
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| plate thickness | 0.050 – 16 mm |
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| Aspect ratio drilling |
1:15 (Drilling freely developed) |
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| capacity | 500 m² / day |
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| Ni layer thickness* | 4 – 7 μm |
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| Pd layer thickness* | >0.05 µm (0.05 – 0.25) for soldering + Al wire bonding 0.15 µm (0.05 – 0.25) for soldering + Au wire bonding |
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| Au layer thickness* | >0.02 µm (0.02 – 0.06) for soldering + Al wire bonding 0.05 µm (0.03 – 0.08) for soldering + Au wire bonding |
* Layer thickness recommendation from the process supplier
immersion Tin
The chemical tin process for lead-free multiple soldering and press-in technologies. In the electronics industry, immersion tin is recognized as a reliable surface for both printed circuit boards and IC substrates.
| format | max. 610 x 2000 mm min. 100 x 60 mm |
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| plate thickness | 0.012 – 5 mm |
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| Aspect Ratio |
1:16 |
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| Micro Vias |
1:1 |
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| layer thickness | 0.6 – 1.2 μm |
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| capacity | 1500 m² / day |
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| Reel to Teel |
on request |
OSP
Glicoat-SMDF2(LX) coatings have excellent heat resistance and are compatible with non-clean soldering fluxers and solder pastes, making it ideal for use on SMD circuit boards and as an alternative to HAL and other finishes.
| format | max. 610 x 2000 mm min. 100 x 60 mm |
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| plate thickness | 0.012 – 5 mm |
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| Aspect Ratio |
1:16 |
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| Micro Vias |
1:1 |
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| layer thickness | 0.15 – 0.3 μm |
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| capacity | 500 m² / day |
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| Reel to Teel |
on request |
immersion Silver
This lead-free surface shows very good soldering behavior even after aging. There is no growth of intermetallic phases during aging. The short process time results in good compatibility with a wide variety of solder resists
| format | max. 610 x 1500 mm min. 100 x 200 mm |
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| plate thickness | 0.05 – 6.0 mm |
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| Aspect Ratio |
1:12 (higher on request) |
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| Micro Vias | 1:1 |
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| layer thickness | 0.15 – 0.45 μm |
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| capacity | 1000 m² / day |
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| Reel to Reel | max. bandwidth 650 mm |
Reel to Reel
| bandwidth | max. 650 mm |
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| length | up to 300 m (depending on the material thickness) |
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| material | all common flex materials |
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| processes | OSP chemical tin chemical silver |