END SURFACES

Electroplated nickel / gold

With the galvanic nickel/gold system, we can offer hard gold and bond gold coatings. Freely programmable sequences enable the construction of different layer combinations. We have flexible frame technology available for processing materials of different thicknesses.

format max. 610 x 900 mm
min. 100 x 100 mm
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plate thickness 0.050 – 20 mm
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MicroVias 1:1
layer properties: Electroplated nickel / gold
Nickel hardness 400 – 450 HV
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hard gold alloy cobalt
purity 99,8%
hardness 140 – 170 HV
density 17 g/cm³
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soft gold purity 99.99%
hardness 80 – 110 HV
density 19.0 g/cm³

 

chemical nickel / gold

Modern system control and automatic dosing devices are prerequisites for a constant quality of the separation. We have various baskets available for a large number of format sizes and thicknesses.

format 630 x 605 mm
min.100 x 200 mm
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plate thickness 0.050 – 15 mm
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Aspect Ratio 1:15 (Drilling freely developed)
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capacity 1000 m² / day (ca. 2000 – 3000 Panel)
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phosphorus content Ni
content Ni
7 – 10 %
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hardness Ni ca. 500 HV
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empf. Au layer thickness 0.05 – 0.1 μm

Immersion Silver / Immersion Gold (ISIG)

The specified layer thicknesses can be used as a multifunctional surface can be used for all soldering and wire bonding applications. Gold layer thicknesses of up to a maximum of 0.3 µm can be deposited with the process. The combination of layers is particularly suitable for high-frequency circuits, medical technology (no nickel) as well as for fine-line technology and flexible printed circuit boards (low total layer thickness). The semi-automatic system enables separation with constant quality, using system control and automatic dosing devices.

format max. 630 x 605 mm
min. 200 x 100 mm
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plate thickness 0.050 – 16.0 mm
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Aspect Ratio 1:15 (Bohrungen frei entwickelt)
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capacity 100 m² / day
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Ag layer thickness* 0.1 – 0.4 µm
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Au layer thickness* 0.05 – 0.20 µm for soldering application
0.10 – 0.20 µm for mixed assembly and bonding applications

*Layer thickness recommendation from the process supplier

Electroless Palladium / Partially Reductive Gold (EPIG)

Electroless palladium gold is a nickel-free finish that can be used in a variety of ways. The layer is suitable for any type of soldering and bonding application. Palladium serves as a diffusion barrier and the gold layer thickness can be variably adjusted up to 0.3 µm thanks to the partially reductive character.

application
Reflow soldering and bonding (aluminum and gold wire) fine line, high-frequency and medical technology

layer properties
Planar surface, bondable with aluminum and gold wire as well as alternative bonding wires, storage time ≥ 12 months

layer thicknesses
0.1 – 0.2 µm Pd / 0.1 – 0.2 µm Auv

format 610 x 610 mm
min. on request (ca. 100 x 100 mm)
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plate thickness 25 µm – 10 mm
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Aspect ratio PTH
1:16
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Aspect ratio BV
1:1 (after copper plating)

reductive gold

Chemical reduction gold is a neutral working, autocatalytic fine gold bath. This layer is suitable for bonding with gold wire. Circuit boards with different solder resists can be processed. The complete free development of all bores is important for a perfect coating

layer properties: reductive gold

format max. 610 x 530 mm
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Au grade 99.99 %
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hardness 60 HV
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density 19 g /cm3
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solderability well
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layer thickness empf. 0.5 – 0.8 μm for Au wire Bo.
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capacity 30 m/ day

Electroless Nickel / Palladium / Gold (ENEPIG)

With the reductively deposited palladium as an intermediate layer, excellent bonding results are achieved with gold wire bonding. This layer is also very suitable for soldering applications and aluminum wire bonding.

format 630 x 605 mm
min. 100 x 200 mm
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plate thickness 0.050 – 16 mm
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Aspect ratio drilling
1:15 (Drilling freely developed)
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capacity 500 m² / day
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Ni layer thickness* 4 – 7 μm
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Pd layer thickness* >0.05 µm (0.05 – 0.25) for soldering + Al wire bonding
0.15 µm (0.05 – 0.25) for soldering + Au wire bonding
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Au layer thickness* >0.02 µm (0.02 – 0.06) for soldering + Al wire bonding
0.05 µm (0.03 – 0.08) for soldering + Au wire bonding

* Layer thickness recommendation from the process supplier

chemical tin

The chemical tin process for lead-free multiple soldering and press-in technologies. In the electronics industry, immersion tin is recognized as a reliable surface for both printed circuit boards and IC substrates.

 

format max. 610 x 2000 mm
min. 100 x 60 mm
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plate thickness 0.012 – 5 mm
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Aspect Ratio
1:16
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Micro Vias
1:1
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layer thickness 0.6 – 1.2 μm
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capacity 1500 m² / day
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Reel to Teel
on request

OSP

Glicoat-SMDF2(LX) coatings have excellent heat resistance and are compatible with non-clean soldering fluxers and solder pastes, making it ideal for use on SMD circuit boards and as an alternative to HAL and other finishes.

format max. 610 x 2000 mm
min. 100 x 60 mm
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plate thickness 0.012 – 5 mm
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Aspect Ratio
1:16
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Micro Vias
1:1
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layer thickness 0.15 – 0.3 μm
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capacity 500 m² / day
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Reel to Teel
on request

 

chemical silver

This lead-free surface shows very good soldering behavior even after aging. There is no growth of intermetallic phases during aging. The short process time results in good compatibility with a wide variety of solder resists

format max. 610 x 1500 mm
min. 100 x 200 mm
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plate thickness 0.05 – 6.0 mm
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Aspect Ratio
1:12 (higher on request)
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Micro Vias 1:1
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layer thickness 0.15 – 0.45 μm
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capacity 1000 m² / day
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Reel to Reel max. bandwidth 650 mm

Reel to Reel

We are able to process rolls on all horizontal systems.

bandwidth max. 650 mm
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length up to 300 m (depending on the material thickness)
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material all common flex materials
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processes OSP
chemical tin
chemical silver