THROUGHPLATING / LBA

Plasma

The pre-treatment for vias in special materials such as polyimide, Teflon, adhesives and hybrid structures takes place in plasma ovens. If necessary, surface cleaning can be carried out in oxygen plasma.

plate thickness	0.050 – 6.0 mm

format	max. 610 x 530 mm min. depending on panel thickness

capacity	100 m² / day

Desmear / etch back

1 horizontal system with glasswort / permanganate is available for desmear. Throughput speed and temperature can be adjusted to different base materials.

format	650 x 1500 mm min.100 x 200 mm

plate thickness	0.050 – 8.5 mm

capacity	850 m² / day

Reel to Reel	max. bandwidth 650 mm

plated through

We are able to process a wide variety of printed circuit board materials and formats on several systems and their combinations. We use chemical copper with subsequent electrolytic reinforcement or final construction.

format	max. 650 x 2000 mm min. 200 x 100 mm

plate thickness	0.050 – 15.0 mm

aspect ratio	1:12 (higher on request)

Blind Micro Via	1:1 (higher on request)

materials	FR 4, FR 5, polyimide, teflon, ceramic, CIC, Metal Reinforced Circuit Boards

Cu layer thickness	5 – …. μm (as desired)

capacity	850 m² / day

Via vertical

With very variable frame technology, we make it possible to process a wide variety of formats and panel thicknesses on this system. Multiple conditioning options ensure reliable vias on a wide range of materials. The traceability of each individual goods carrier is ensured with a modern control.

format	650 x 1500 mm min.100 x 200 mm

plate thickness	0.050 – 15.0 mm

capacity	200 – 250 m² / day

DK horizontal / plating vertical

This process flow consists of horizontal desmear and electroless copper with subsequent electrolytic copper plating in a vertical plant. The advantage of this combination is the high daily capacity of 450 m² for large series.

format	max. 650 x 2000 mm min. 200 x 100 mm

plate thickness	0.050 – 15.0 mm

capacity	450 m² / day

DK horizontal / plating horizontal

format	650 x 2000 mm min. 350 x 220 mm

plate thickness	max. 3.0 mm min. 0.1 mm

Aspect ratio drilling	1:12

Aspect Ratio Vais	1:1

capacity	150 – 200 m² / day

Reel to Reel	max. bandwidth 650 mm

conductive pattern construction

Based on one of the direct metallization methods or galvanically prepared copper bores, we selectively build up the structured circuit patterns (pattern plating). The flexible system control makes it possible to apply different layer thicknesses or etching resists (pure tin or tin ₆₀ / lead ₄₀). The copper baths are operated with a pulse plating electrolyte.

format	max. 700 x 2000 mm min. 200 x 200 mm

plate Thickness	0.05 – 15 mm

covers	all known photoresists (Printing colors after testing)

Aspect ratio drilling	1:10 (higher after pre-test)

Blind microvias	1:1

capacity	200 m² / day

Microfill 2

This process allows blind microvias to be filled at the same time as through-holes to be reinforced. With the use of photoresists, a selective conductive pattern can be built up.

format	650 x 2000 mm min. 200 x 100 mm

plate Thickness	0.050 – 15.0 mm

Aspect ratio drilling	1:10

Blind Microvia	Ø 70 – 120 μm

Aspect Ratio	bis 1:1

layer thickness surface	depending on Ø and degree of filling

capacity	on request

THF – Through hole filling

THF – Electrolytically fill through-holes with copper

With this process, which consists of 2 separate process stages, through-holes can be 100% filled with copper, whereby the copper layer thickness on the surface increases comparatively minimally

Filling the continuous bores with copper improves their thermal and electrical conductivity considerably.

PCBs with copper filled through holes have excellent reliability and can easily withstand the currents used in high power, high frequency, microwave and LED PCBs.

format	max. 610 x 460 mm min. 200 x 200 mm

plate Thickness	0.025 – 0.8 mm

covers	all known photoresists (Printing colors after testing)