THROUGHPLATING / LBA

Plasma

The pre-treatment for vias in special materials such as polyimide, Teflon, adhesives and hybrid structures takes place in plasma ovens. If necessary, surface cleaning can be carried out in oxygen plasma.

plate thickness 0.050 – 6.0 mm
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format max. 610 x 530 mm min. depending on panel thickness
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capacity 100 m² / day

Desmear / etch back

1 horizontal system with glasswort / permanganate is available for desmear. Throughput speed and temperature can be adjusted to different base materials.

format 650 x 1500 mm
min.100 x 200 mm
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plate thickness 0.050 – 8.5 mm
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capacity 850 m² / day
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Reel to Reel max. bandwidth 650 mm

plated through

We are able to process a wide variety of printed circuit board materials and formats on several systems and their combinations. We use chemical copper with subsequent electrolytic reinforcement or final construction.

format max. 650 x 2000 mm
min. 200 x 100 mm
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plate thickness 0.050 – 15.0 mm
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aspect ratio 1:12 (higher on request)
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Blind Micro Via 1:1 (higher on request)
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materials FR 4, FR 5, polyimide, teflon, ceramic, CIC, Metal Reinforced Circuit Boards
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Cu layer thickness 5 – …. μm (as desired)
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capacity 850 m² / day

Via vertical

With very variable frame technology, we make it possible to process a wide variety of formats and panel thicknesses on this system. Multiple conditioning options ensure reliable vias on a wide range of materials. The traceability of each individual goods carrier is ensured with a modern control.

format 650 x 1500 mm
min.100 x 200 mm
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plate thickness 0.050 – 15.0 mm
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capacity 200 – 250 m² / day

DK horizontal / plating vertical

This process flow consists of horizontal desmear and electroless copper with subsequent electrolytic copper plating in a vertical plant. The advantage of this combination is the high daily capacity of 450 m² for large series.

format max. 650 x 2000 mm
min. 200 x 100 mm
blaue Linie
plate thickness 0.050 – 15.0 mm
blaue Linie
capacity 450 m² / day

DK horizontal / plating horizontal

With very variable frame technology, we make it possible to process a wide variety of formats and panel thicknesses on this system. Multiple conditioning options ensure reliable vias on a wide range of materials. The traceability of each individual goods carrier is ensured with a modern control.

format 650 x 2000 mm
min. 350 x 220 mm
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plate thickness max. 3.0 mm
min. 0.1 mm
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Aspect ratio drilling
1:12
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Aspect Ratio Vais
1:1
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capacity
150 – 200 m² / day
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Reel to Reel
max. bandwidth 650 mm

 

conductive pattern construction

Based on one of the direct metallization methods or galvanically prepared copper bores, we selectively build up the structured circuit patterns (pattern plating). The flexible system control makes it possible to apply different layer thicknesses or etching resists (pure tin or tin 60 / lead 40). The copper baths are operated with a pulse plating electrolyte.

format max. 700 x 2000 mm
min. 200 x 200 mm
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plate Thickness 0.05 – 15 mm
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covers
all known photoresists
(Printing colors after testing)
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Aspect ratio drilling
1:10 (higher after pre-test)
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Blind microvias 1:1
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capacity
200 m² / day

 

Microfill 2

This process allows blind microvias to be filled at the same time as through-holes to be reinforced. With the use of photoresists, a selective conductive pattern can be built up.

format 650 x 2000 mm
min. 200 x 100 mm
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plate Thickness 0.050 – 15.0 mm
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Aspect ratio drilling
1:10
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Blind Microvia
Ø 70 – 120 μm
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Aspect Ratio bis 1:1
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layer thickness surface depending on Ø and degree of filling
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capacity on request

THF – Through hole filling

THF – Electrolytically fill through-holes with copper

With this process, which consists of 2 separate process stages, through-holes can be 100% filled with copper, whereby the copper layer thickness on the surface increases comparatively minimally

Filling the continuous bores with copper improves their thermal and electrical conductivity considerably.

PCBs with copper filled through holes have excellent reliability and can easily withstand the currents used in high power, high frequency, microwave and LED PCBs.

format max. 700 x 2000 mm
min. 200 x 200 mm
blaue Linie
plate Thickness 0.05 – 15 mm
blaue Linie
covers
all known photoresists
(Printing colors after testing)