The variety of printed circuit boards concerning their structure and material type has continuously increased in recent years. The new DPL-3 facility is designed precisely for those new challenges. It can process copper foils with a thickness of 8 µm just as reliably as a 15mm thick printed circuit boards. The plating line has 3 different electrolytes to offer a solution for each product and each challenge, be this, smallest and / or larger blind holes (> 200µm), which can be filled with an Advanced Via Filling. The new, SAP – based, chemical copper process also puts the steadily increasing requirements (IST tests etc.) on the Cu-Cu connection on a new level.