Afinum acquires the Hofstetter Group

Press release dated 13. September 2023 Afinum acquires the Hofstetter Group  Afinum Neunte Beteiligungsgesellschaft mbH & Co. KG, advised by Afinum Management GmbH, indirectly acquires Hofstetter PCB AG (Hofstetter PCB) including its subsidiaries SMF...

Plasma Boffoto

We are pleased to announce that we have further improved our services in the field of PCB plating. By investing in a state-of-the-art plasma oven, we are now able to significantly reduce the turnaround times for copper plating. Our new plasma oven has been supplied by...

Vertical Plating DPL-3

Vertical Plating DPL-3  The variety of printed circuit boards concerning their structure and material type has continuously increased in recent years. The new DPL-3 facility is designed precisely for those new challenges. It can process copper foils with a...

CONNECTING DIGITALLY WHAT BELONGS TOGETHER

CONNECTING DIGITALLY WHAT BELONGS TOGETHER The guiding principle of our new website could be something like this. The Hofstetter Group now presents itself together and in a new guise. Thanks to its responsive design, the new website can also be optimally displayed on...

Conversion of ISIG process to EPIG or DIG

CONVERSION OF THE ISIG PROCESS TO EPIG OR DIG  We would like to inform you that the ISIG process will be discontinued at Hofstetter PCB AG. As a replacement, DIG was introduced at the Küssnacht site, and as an alternative, the nickel-free finish with palladium...