CONVERSION OF THE ISIG PROCESS TO EPIG OR DIG
We would like to inform you that the ISIG process will be discontinued at Hofstetter PCB AG. As a replacement, DIG was introduced at the Küssnacht site, and as an alternative, the nickel-free finish with palladium and gold, called EPIG. With these 2 options, we can meet the market demand for nickel free finishes as both are solderable and Au wire bondable. The date of discontinuation is December 31, 2022. Last orders for the ISIG process must be placed in early December 2022.
Please refer to the attached letter for more detailed information.
Conversion of ISIG process to EPIG or DIG (494 KB, PDF)